DLAP-3000-CFL Series
Embedded System supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket.
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SYSTEM CORE |
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Processor |
Intel® Core™ i7-9700TE, 1.8GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® Core™ i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® Core™ i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® Core™ i3-8100T, 3.1GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® Celeron® G4900T, 2.9GHz, 2M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/2T) |
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Memory |
Non-ECC DDR4 2666/2400MHz, 2x SO-DIMM, up to 64GB (dependent on CPU) system memory |
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Chipset |
Intel H310 Chipset |
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I/O INTERFACES |
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Display |
6x DisplayPort (2 from CPU, 4 from MXM) |
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Ethernet |
1x GbE (Intel® i219-LM), 3x GbE (Intel® i210-AT) |
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Serial Ports |
1x RS-232/422/485, 1x RS-232 |
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USB |
4x USB 3.1 Gen1 ports, 4x USB 2.0 ports |
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M.2 |
1x M.2 E key supporting 1630 or 2230 for Wi-Fi/BT module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module |
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Digital IO |
Default: w/o DIO Option: 1x DI/DO with 4 in, 4 out, one ground pin , and one power pin (no power/5V/12V, 0.5A by BIOS selection) |
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Audio |
Default: w/o Audio Option 1: Mic-in, Line-out, Line-in Option 2: Mic-in, L/R speaker-out (6W + 6W) Option 3: Line-in, L/R speaker-out (6W + 6W) |
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TPM 2.0 |
Optional |
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eSIM |
Optional |
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STORAGE |
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SATA |
2x 2.5" SATA 6Gb/s external drive bays 1x SATA 6Gb/s signal via M.2 B key connector |
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MECHANICAL |
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Dimensions |
235 x 182 x 75mm (W x D x H) |
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Mounting |
Optional wall-mount bracket |
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POWER SUPPLY |
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DC Input |
DC 12V input (Molex DC-in jack) |
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AC Input |
Optional: 240W (12V/20A) AC/DC adapter |
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ENVIRONMENTAL |
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Operating Temperature |
0°C to 50°C (W/MXM, W/SSD) |
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Humidity |
10% to 90%, non-condensing |
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Storage Temperature |
-20°C to 60°C |
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EMC |
EN55032/EN55024 |
| Safety |
UL/cUL, CB, CCC |
